by Darshil Patel

In 2025, the IoT market is projected to exceed $3 trillion. Here are three new IoT modules that may support this tidal wave of devices.

The Internet of Things (IoT) transforms how devices connect, communicate, and assist various industries. New IoT modules must handle complex tasks while fitting into compact, power-efficient devices. One of these complex tasks is bringing connectivity to remote and challenging environments. These applications require modules that can function across diverse networks and support multiprotocol communication, real-time analytics, and secure data handling. This article discusses three recently released IoT modules that target applications with such high demands.

Murata Shrinks Wireless Modules

Murata Manufacturing has introduced its Type 2FR/2FP and Type 2KL/2LL wireless communication modules for smart homes, industrial IoT, and beyond. The Type 2FR/2FP modules measure 12.0 mm x 11.0 mm x 1.5 mm, making them one of the smallest tri-radio Thread devices, according to Murata.

It integrates Wi-Fi 6, Bluetooth 5.4, and OpenThread connectivity alongside a high-performance, 260-MHz Arm Cortex-M33 microcontroller unit (MCU). The device's compactness allows engineers to make more portable IoT devices while reducing the complexity of layouts. Compactness also translates to fewer design trade-offs, enabling high performance and reliability even in size-constrained applications.

The module can operate as a standalone device or co-processor, running network stacks and user applications natively. It is also compatible with the Matter ecosystem, a unifying standard for IoT devices, ensuring seamless and secure communication across platforms. The Type 2FR/2FP is certified for SESIP3 and PSA3 cybersecurity standards, eliminating the need for an additional security IC. Furthermore, its low power consumption and integrated design significantly reduce the bill of materials (BoM). These features make the 2FR/2FP useful for diverse applications, from HVAC systems and smart energy solutions to industrial automation and medical devices.

Murata designed the Type 2KL/2LL family for IoT applications demanding robust performance. These modules, powered by the NXP IW610 chipset, target systems using mid-to-high-performance processors, such as those running Linux or real-time operating systems (RTOS).

Like their compact sibling, the 2KL/2LL modules support Wi-Fi 6, Bluetooth 5.4, and Thread while including Matter provisioning. However, they emphasize cost-effectiveness, addressing the financial constraints often faced by IoT developers. Their applications include imaging devices, smart energy solutions, home accessories, and building automation.

ST Introduces Wireless Module With Matter Over Wi-Fi

STMicroelectronics has unveiled the ST67W611M1 IoT module as part of its strategic partnership with Qualcomm Technologies. This collaboration aims to simplify the design of next-generation industrial and consumer IoT devices by blending ST's STM32 ecosystem with Qualcomm's wireless connectivity.

The ST67W611M1 modules. Image used courtesy of STMicroelectronics

At the heart of the ST67W611M1 is the Qualcomm QCC743 multiprotocol connectivity SoC, which supports Wi-Fi 6, Bluetooth 5.3, and Thread. Including Matter over Wi-Fi in the ST67W611M1 bridges the STM32 ecosystem with the Matter framework, allowing developers to create products that easily integrate into different ecosystems.

For circuit designers, Matter over Wi-Fi eliminates common connectivity roadblocks, offering direct communication with no intermediary hubs while leveraging the high throughput and reliability of Wi-Fi networks. The module provides 4 MB of onboard Flash for code and data storage, a 40-MHz crystal for clocking, and the option of an integrated PCB antenna or an external antenna via an uFL connector. Its compact 32-lead LGA package design allows developers to embed advanced wireless functionality into streamlined, cost-effective PCBs with as few as two layers.

The module includes built-in hardware cryptographic accelerators, secure boot, and secure debug features, achieving PSA Certified Level 1 protection. In addition, the modules can be coupled with STM32Cube tools, software, and AI-focused advancements like the STM32N6 MCUs with Neural-ART accelerator.

Iridium Gears Module for Satellite IoT

Iridium Communications recently launched its Iridium Certus 9704 and the Iridium Certus 9704 development kit for demanding IoT applications. The module boasts a 34% smaller size than its predecessor and an 83% reduction in idle power consumption compared to earlier models. Iridium claims its compact form simplifies integration into space-efficient designs without compromising power or performance.

The Certus 9704 module. Image used courtesy of Iridium Communications

This module stands out because it allows larger data transfers and quicker messaging. The inclusion of Iridium Messaging Transport (IMT) technology supports efficient, topic-sorted communication for applications ranging from telemetry monitoring and remote asset tracking to command and control of uncrewed vehicles and vessels. The module's large data message capability also accommodates applications beyond traditional telemetry. The Certus 9704 can integrate picture and audio messaging, unlocking opportunities for remote sensing, diagnostics, and personal safety devices.

The new module also allows developers to offload intensive computing tasks to the cloud, where AI engines can analyze data and send actionable instructions back to devices. By leveraging the Certus 9704, companies can reduce the processing power required at the edge, lowering hardware costs while increasing battery life and device longevity.